Description: | - Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors - Unparalleled Performance:Hybrid 6+2+1 Phases Digital VRM Solution - Dual Channel DDR5:4*DIMMs XMP Memory Module Support - Next Generation Storage:2*PCIe 4.0 x4 M.2 Connectors - M.2 Thermal Guard:To Ensure M.2 SSD Performance - EZ-Latch:PCIe 4.0x16 Slot with Quick Release Design - Fast Networks:2.5GbE LAN & Wi-Fi 6E 802.11ax - Extended Connectivity:Rear USB-C® 10Gb/s, DP, HDMI - Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP - Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card |
Vendor Homepage: | www.gigabyte.com/Motherboard/B760M-DS3H-AX-rev-1x#kf |
Model: | B760M DS3H AX 1.2 |
Chipset: | Intel B760 Express |
Socket: | LGA1700 |
Form Factor: | Micro-ATX |
Memory type: | DDR5 |
Frequency speed: | 4000/4600/4800/5200/5400/5600/5800/6000/6800/7000/7200/7400/7600MHz |
Memory slots: | 4 |
M.2: | 2 |
PCI-Express 3.0 1x: | 2 |
PCI-Express 4.0 16x: | 1 |
Audio-In: | 2 |
Audio-Out: | 1 |
DisplayPort: | 2 |
HDMI: | 1 |
PS/2: | 1 |
RJ45: | 1 |
USB 2.0: | 2 |
USB 3.2: | 3 |
USB-C: | 1 |
Bluetooth: | Yes |
SATA: | Yes |
WiFi: | Yes |
Integrated video: | Yes |
Integrated LAN: | 2.5 Gigabit |
Integrated audio: | Yes |
RAID: | SATA 0, 1, 5, 10 |
TPM: | Header |
Shipping box quantity: | 10 |
Shipping Box Depth: | 55cm |
Shipping Box Height: | 30cm |
Shipping Box Weight: | 12.35kg |
Shipping Box Width: | 38cm |
Unit Brutto Volume: | 0.00627m³ |
Unit Net Weight: | 0.75kg |
Unit Gross Weight: | 1.23kg |
Unit Box Width: | 0.28 |
Unit Box Length: | 0.27 |
Unit Box Height: | 0.07 |
Full Description Line: | Intel B760 Express|LGA1700|Micro-ATX|DDR5|7600/7400/7200/7000/6800/6000/5800/5600/5400/5200/4800/4600/4000 MHz|Memory slots 4|2xPCI-Express 3.0 1x|1xPCI-Express 4.0 16x|2xM.2|1xHDMI|2xDisplayPort|2xAudio-In|1xAudio-Out|2xUSB 2.0|3xUSB 3.2|1xUSB-C|1xPS/2|1xRJ45|SATA|Bluetooth|WiFi|Video|LAN 2.5 Gigabit|Audio|RAID SATA 0, 1, 5, 10|TPM Header |
Category Code: | MBI |